- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/118 - Masterslice integrated circuits
Patent holdings for IPC class H01L 27/118
Total number of patents in this class: 1095
10-year publication summary
73
|
90
|
113
|
155
|
140
|
105
|
129
|
83
|
105
|
37
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
224 |
Samsung Electronics Co., Ltd. | 131630 |
151 |
Socionext Inc. | 1575 |
78 |
Qualcomm Incorporated | 76576 |
77 |
Monolithic 3D Inc. | 270 |
60 |
Semiconductor Energy Laboratory Co., Ltd. | 10902 |
28 |
Texas Instruments Incorporated | 19376 |
25 |
Micron Technology, Inc. | 24960 |
23 |
Renesas Electronics Corporation | 6305 |
21 |
Sony Corporation | 32931 |
16 |
International Business Machines Corporation | 60644 |
16 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
16 |
Intel Corporation | 45621 |
14 |
Edico Genome, Corp. | 43 |
14 |
Rohm Co., Ltd. | 5843 |
12 |
Schottky Lsi, Inc. | 19 |
11 |
Advanced Micro Devices, Inc. | 5326 |
10 |
SK Hynix Inc. | 11030 |
8 |
Altera Corporation | 2241 |
8 |
United Microelectronics Corp. | 3921 |
8 |
Other owners | 275 |